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  1. Home/
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Engineering partnership between U of I, Hiroshima University aims to fill semiconductor workforce gap

New MESA program gives students international experience while preparing them for high-demand semiconductor, AI and energy careers

Aerial view of university campus.An aerial view of Hiroshima University, University of Idaho’s partner institution in Japan for the new Microchip Engineering and Security Alliance (MESA).

May 13, 2026

MOSCOW, Idaho — University of Idaho students will soon have the opportunity to study electrical engineering at one of Japan’s most prestigious universities before completing their degrees in Moscow through a new partnership with Hiroshima University. The Microchip Engineering and Security Alliance (MESA) creates a four-year degree pathway designed to help meet growing global demand for engineers in semiconductor and artificial intelligence industries.

“MESA is a powerful partnership, connecting hands-on experiences in U of I’s state-of-the-art fabrication, manufacturing and artificial intelligence laboratories with Hiroshima’s deep technological knowledge in materials and device engineering,” U of I College of Engineering Dean Suzie Long said. “If your goal is to be hired quickly in the U.S. semiconductor industry or internationally, this is the path.”

The first MESA cohort will begin in August 2026. Students will spend their first two years studying in English at Hiroshima University before transitioning to U of I’s Moscow campus to complete their degrees. U of I will operate dedicated classroom and office space on Hiroshima University’s campus to support students during their first two years.

“Students in this program are University of Idaho students from day one — they’re not transferring later,” said Dean Kahler, vice provost for strategic enrollment management. “They start with us, receive support while studying in Japan and then complete their degree in Moscow.”

The program is open to students worldwide, including Idaho residents, domestic students and international applicants. Its structure and cost may be especially attractive to nonresident and international students, while scholarships supported by donors will help offset costs for Idaho students.

MESA responds to a growing global demand for electrical engineers — particularly in areas tied to microchips, artificial intelligence and energy systems. Industry estimates show more than 1 million semiconductor-related jobs will need to be filled worldwide by 2030. University leaders aim to grow enrollment in the MESA program to as many as 100 new students per year.

“We don’t have enough electrical engineers to meet the demand for technologies like AI and semiconductor production,” Long said. “This program is one way we can help close that gap.”

The program builds on a decades-long relationship between the two universities — one that began in the aftermath of World War II and has grown into a modern academic partnership.

In 1951, Hiroshima University President Tatsuo Morito asked institutions around the world for help rebuilding after the atomic bombing. U of I was one of only a handful of U.S. institutions to respond. Forestry professor Merrill Deters sent tree seeds, a book on forestry and a $3 donation.

That early act of goodwill has grown into a long-term academic relationship focused on education, exchange and shared learning.

In recent years, the partnership has expanded to include a short-term student exchange that brings students from both universities together to explore culture, sustainable solutions and global issues. The inaugural cohort of U of I students will travel to Hiroshima this spring.

“Japan and the United States were once adversaries, and today they’re not just allies — they’re partners and friends,” said Sean Quinlan, dean of the College of Letters, Arts and Social Sciences, who has played a key role in building the university’s international partnership with Hiroshima University. “This partnership reflects that shared future and gives students a chance to be part of it.”

For more information, visit uidaho.edu/mesa.

Media contact

Danae Lenz
External Communications Coordinator
208-885-1605
dlenz@uidaho.edu

Related Topics

InternationalEngineeringTechnology and Cybersecurity

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