The Next Generation Microelectronics Research Center (NGeM) is focused on providing students a deep understanding of the microelectronic chip development processes, from the theoretical mathematics fundamental to design to packaging and device fabrication. Students interested in NGeM education and research are recommended to consider the following courses.
Introduction to Electronic Packaging
Course No.: ECE 418/518
This course serves as an introduction to electronic packaging and “back-end” microelectronic processes. Topics include substrate design and fabrication, SMT and first level assembly, clean room protocol, thermal design, simulation and process considerations.
Introduction to Microelectronics Fabrication
Course No.: ECE 404/504
This course serves as an introduction to the fabrication of microelectronic devices. Topics include the basics of IC structures, clean room protocol, photolithography, film growth and deposition, as well as IC interconnect technologies.
Power Electronics and Drives
Course No.: ECE 427
This course explores the characteristics, limitations and application of solid state power devices; induction machines; analysis and application of AC and DC drives; practical aspects of power electronic converter design, including rectifiers and inverters; choppers, AC phase control, device gating techniques and snubbers.
Course No.: ECE 460
This course covers crystal structure, quantum mechanics, energy band and statistical mechanics of semiconductor devices; carrier transportation, PN junction and heterojunctions structure and Mosfet structure; electro optics.