Feng Li

Micron Endowed Chair in Microelectronics, NGeM Director, FIB/SEM Director

Ph.D. in Electrical Engineering, University of Wisconsin - Milwaukee 

M.S. in Electrical Engineering, University of Texas at Arlington 

M.S. in Electrical Engineering, Beijing University of Posts and Telecommunications 

B.S. in Physics, Ocean University of China

Portrait of Feng Li - Micron Endowed Chair in Microelectronics, NGeM director, FIB/SEM director, Department of Electrical and Computer Engineering; College of Engineering.
Areas of expertise
  • 3D / Heterogeneous integration and advanced packaging,
  • Next-Node logic & memory architectures (VLSI & Beyond),
  • Multiphysics modeling, simulation, and AI-Driven design automation and optimization,
  • Advanced power & Wide-bandgap devices and integrated circuits (WBG-ICs),
  • Signal & power integrity, interconnects & On-Chip networks.
Contact me
fengli@uidaho.edu

208-885-7571

Gauss-Johnson Engineering Laboratory, 217

College of Engineering, Department of Electrical and Computer Engineering

View my academic profile