Feng Li

Micron Endowed Chair in Microelectronics, NGeM Director, FIB/SEM Director

Ph.D., Electrical engineering, University of Wisconsin - Milwaukee
M.S., Electrical engineering, University of Texas at Arlington
M.S., Electrical engineering, Beijing University of Posts and Telecommunications
B.S., Physics, Ocean University of China
Portrait of Feng Li - Micron Endowed Chair in Microelectronics, NGeM director, FIB/SEM director, Department of Electrical and Computer Engineering; College of Engineering.
Areas of expertise
  • 3D / Heterogeneous integration and advanced packaging,
  • Next-Node logic & memory architectures (VLSI & Beyond),
  • Multiphysics modeling, simulation, and AI-Driven design automation and optimization,
  • Advanced power & Wide-bandgap devices and integrated circuits (WBG-ICs),
  • Signal & power integrity, interconnects & On-Chip networks.
Contact me
fengli@uidaho.edu

208-885-7571

Gauss-Johnson Engineering Laboratory, 217

College of Engineering, Department of Electrical and Computer Engineering

View my academic profile