The Next Generation Microelectronics Research Center (NGeM) is dedicated to the mission of innovative microelectronics education, research and scholarship. NGeM is focused on providing students a deep understanding of the microelectronic chip development processes, from the theoretical mathematics fundamental to design to packaging and device fabrication.
NGeM faculty are focused on providing undergraduate and graduate level coursework and leading sponsored research experiences for students at all levels. NGeM provides students with exposure to real-world phases of microelectronic packaging such as wafer dicing, wire bonding, die attach, screen printing, low temperature co-fired ceramics and substrate fabrication.
NGeM provides opportunities for industry sponsored research led by NGeM faculty who are experts in their field. Students at all levels are encouraged to engage with NGeM faculty in on-going state-of-the-art sponsored research. Faculty are currently working on projects funded by the National Science Foundation, the Micron Foundation, the M. J. Murdock Charitable Trust, the II-VI Foundation and the Idaho GEM Grant Program. Students working on sponsored research gain essential hands-on experience in microelectronics, project management and critical skills that will make them successful in the workplace.
Scholarship is also a vital objective of the NGeM mission. NGeM faculty members are actively engaged in the publication of journal and conference papers, as well as books, book chapters and presentations on key topics in microelectronics and electronic packaging.