U of I celebrates 31 years of engineering innovation at Engineering Design EXPO April 26

MOSCOW, Idaho — The public is invited to experience the many ways University of Idaho engineering students are making a difference and solving real-world problems during the 31st Engineering Design EXPO Friday, April 26.

Student teams will present projects from 9 a.m. to noon Friday, April 26, in the ICCU Arena on the Moscow campus. Project details are available to browse online.

Team projects are the culmination of the U of I College of Engineering’s Interdisciplinary Capstone Design Program, recognized by the National Academy of Engineering as one of the top seven in the nation for infusing real-world experiences into undergraduate education.

A group of computer science and biological and mechanical engineering students are partnering with Whitman Hospital in Colfax, Washington, to improve medical devices used in real-time x-ray imaging during complicated surgical procedures.

The college’s longstanding partnership with NASA continues as a team of capstone students is working to advance NASA-patented unmanned aerial vehicle (UAV) technology. The student team is using NASA’s UAV design for a critical use in the Pacific Northwest — identifying wildfire hot spots.

The U of I’s first cohort of undergraduate cybersecurity students will present their small-scale model of an industrial control system at EXPO. The system is low-cost, modular and can be run in a virtual environment to perform critical cybersecurity-related research.

Senior Director of U.S. Expansion Planning at Micron Technology Jeff Binford will deliver the EXPO’s keynote address 12:30 p.m. Friday, April 26, in the ICCU Arena.

Binford’s more than 20-year professional career has been with Micron Technology, working in planning, operations and strategy roles in Idaho, Utah, Virginia, Japan and Singapore.

He recently moved into a new role as senior director of U.S. expansion planning, setting the strategy and building a comprehensive plan for Micron's more than $100 billion semiconductor fabrication facility expansion in Idaho and New York, the largest expansion in U.S. history to increase domestic supply of leading-edge memory chips.

Students will also publicly present their projects virtually 2-5 p.m. Thursday, April 25, and Friday, April 26.

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Media Contact

Alexiss Turner
Marketing & Communications Manager
College of Engineering
208-885-7511
alexisst@uidaho.edu