3D Imaging and Printing Lab
Welcome to the University of Idaho 3D Imaging and Printing Lab
Located in the U of I's Integrated Research and Innovation Center, the 3D Imaging and Printing Lab features state-of-the-art 3D scanning and printing capabilities that take advantage of modern X-ray technology. The scanner and printer were purchased with funding from the National Science Foundation (NSF) MRI program, Award 2019231, and the M.J. Murdock Charitable Trust.
Questions about the lab? Please contact the Director, Tao Xing, Ph.D., P.E., Professor of Mechanical Engineering by email or by phone at: 208-885-9032
Physical Address:
Integrated Research & Innovation Center (IRIC), Room 221
685 South Line Street, Moscow ID. 83844
Mailing Address:
University of Idaho
875 Perimeter Dr. MS 1122
Moscow, ID. 83844-1122
Web: uidaho.edu/3dip | Lab Phone: 208-885-1227
| Feature | Specification | Benefit |
|---|---|---|
| X-ray source | 40 – 100 kV 10 W 5 µm spot size at 4 W |
Maintenance-free sealed X-ray source Fast scans for QC, or 4D XRM |
| X-ray detector | Active pixel CMOS flat-panel 3 MP (1944 x 1536) 75 µm pixel size |
Excellent signal-to-noise Large Field-of-View |
| Object size | 96 mm diameter 120 mm height |
Capable to scan a large range of sample sizes |
| Sample changer (optional) |
16 samples up to 50 mm diameter 8 samples up to 96 mm diameter External access |
Unattended high throughput Any combination of large and small samples Add/remove samples at any time without interrupting the actual scan |
| Dimensions | W 1040 mm x D 665 mm x H 400 mm Weight 170 kg |
Space-saving desktop system that fits in every lab |
| Power supply | 100-240V AC, 50-60Hz, 3A max | Minimum installation requirements, a standard power supply suffices |
| Model Materials |
|
|---|---|
| Digital Model Materials |
|
| Support Materials | SUP705™ (water jet removable) SUP706B™ (soluble) |
| Build Size | 490 x 390 x 200 mm (19.3 x 15.35 x 7.9 in.) |
| Layer Thickness | Horizontal build layers down to 14 microns (0.00055 in.) 55 microns (0.002 in.) in Super High Speed1 mode |
| Workstation Compatibility | Windows 10 |
| Network Connectivity | LAN — TCP/IP |
| System Size and Weight | System: 1400 x 1260 x 1100 mm (55.1 x 49.6 x 43.4 in.); 430 kg (948 lbs.) Material Cabinet: 1119 x 656 x 637 mm (44 x 25.8 x 25.1 in.); 153 kg (337 lbs.) |
| Operating Conditions | Temperature 18 – 25 °C (64 – 77 °F); relative humidity 30-70% (non-condensing) |
| Power Requirements | 100–120 VAC, 50–60 Hz, 13.5 A, 1 phase 220–240 VAC, 50–60 Hz, 7 A, 1 phase |
| Regulatory Compliance | CE, FCC, EAC, RCM, R-NZ |
| Software | GrabCAD Print |
| Build Modes | High Quality: up to 7 base resins, 14-micron (0.00055 in.) resolution High Mix: up to 7 base resins, 27-micron (0.001 in.) resolution High Speed: up to 3 base resins, 27-micron (0.001 in.) resolution Super High Speed: 1 base resin, 55-micron (0.002 in.) resolution |
| Accuracy | Typical deviation from STL dimensions, for models printed with rigid materials, based on size: under 100 mm – ±100μ; above 100 mm – ±200μ or ± 0.06% of part length, whichever is greater. |
Scanning Job Application Process
- Fill in the scanning application form (above)
- Send the form and sample* to xing@uidaho.edu
- You will receive a quote for the cost
- If cost agreed, sign and send the form back
- We will send you the scanned images via cloud
Printing Job Application Process
- Fill in the printing application form (above)
- Send the form and geometry* to xing@uidaho.edu
- You will receive a quote for the cost
- If cost agreed, sign and send the form back
- We will send you the printed object (external customers are responsible for shipping cost)
*If sample/geometry is confidential, indicate in the email and request a Non-Disclosure Agreement (NDA)