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Barlow Receives IMAPS Technical Achievement Award

Tuesday, November 1 2011

Fred Barlow received the "John A. Wagnon, Jr. Technical Achievement Award" during IMAPS 2011 (International Microelectronics And Packaging Society) at the 44th International Symposium held in Long Beach, California.

His award citation is “For his past and present achievements in electrical design, package assembly, substrate fabrication integrated passive components and packaging of power electronic and high frequency/high speed circuits and his continued contribution to the microelectronics body of knowledge”. Fred is a Fellow member of the society, and Editor-in-Chief of the Journal.