students walk on University of Idaho campus

Visit U of I

Learn about the many reasons the University of Idaho could be a perfect fit for you. Schedule Your Visit

Parents on campus during orientation

Homecoming Oct. 1-7

Join other Vandal families for a week of celebration and Vandal traditions. View Calendar

campus full of students

U of I Retirees Association

UIRA has a membership of nearly 500 from every part of the University. Learn More

Technology, Innovation and Economic Development

Physical Address:
Morrill Hall 103
Moscow, Idaho

Mailing Address:
875 Perimeter Drive
MS 3003
Moscow, ID 83844-3003

Phone: 208-885-4550

Fax: 208-885-4550

Email: tamsen@uidaho.edu

Web: OTT Website

Map

Physical Address:
Water Center Suite 324
Boise, Idaho

Mailing Address:
322 E. Front St., Suite 324
Boise, ID 83702

Phone: 208-364-4568

Email: janajones@uidaho.edu

Stacked Printed Circuit Board Implementations of Three Dimensional Antennas

Tech Id: 16-015

Inventors: Dr. Ata Zadeghol

Unmet Need

Antennas have found numerous applications, especially in wireless network, near field communication, 3D integration, next generation data storage, etc. While the recent developments in antennas is attributed by low power, smaller size, and interface facility, the realization of complex antenna design and fabrication using cost efficient printed circuit board (PCB) technology is less explored. The current state of art utilizes techniques like Low Temperature Cofired Ceramic (LTCC) that is costly. PCB stacking techniques used with success for design of small wireless sensor nodes has opened a new avenue in designing cost efficient 3D antennas.

Invention Description

Researchers at the University of Idaho have developed a novel hemispherical antenna design that utilizes stacks of two-layer printed circuit boards to create the 3D hemispherical structure. The novel approach overcomes the implementation and fabrication challenges faced by the current state of art by leveraging PCB technology. This method provides simplified alternatives to wire based fabrication methods to realize complex antenna geometries. The novel approach offers considerable cost savings over the Low Temperature Cofired Ceramic (LTCC) technology, which is 20 times the costs of PCB based designs.

Market Potentials/Applications

  • Smart Antenna for mobile devices
  • Consumer electronics
  • Smart Grids
  • 3D Integrated circuits
  • Wearable electronics
  • Wireless networks

Key Benefits/Advantages

  • Cost efficient approach to create 3D hemispherical structure.
  • Smaller form factor
  • Reduced size compared to wire base antenna
  • Reduces overall cost
  • Need not remove copper layers below the antenna as compared to ceramic chip antenna

Development Stage

Tested

IP Status

Provisional

Publication

Design and simulation of a four-arm hemispherical helix antenna realized through a stacked printed circuit board structure

For Licensing Contact


Lokesh Mohan
Licensing Associate

820, Idaho Avenue,
Rm 105, Moscow,
Idaho- 83844

Phone: 208.885.4550
Email: mohanL@uidaho.edu
          ott@uidaho.edu

Stacked Printed Circuit Board image
Stacked Printed Circuit Board Implementations of 3D Antennas

Technology, Innovation and Economic Development

Physical Address:
Morrill Hall 103
Moscow, Idaho

Mailing Address:
875 Perimeter Drive
MS 3003
Moscow, ID 83844-3003

Phone: 208-885-4550

Fax: 208-885-4550

Email: tamsen@uidaho.edu

Web: OTT Website

Map

Physical Address:
Water Center Suite 324
Boise, Idaho

Mailing Address:
322 E. Front St., Suite 324
Boise, ID 83702

Phone: 208-364-4568

Email: janajones@uidaho.edu