Stacked Printed Circuit Board Implementations of Three Dimensional Antennas
Tech Id: 16-015
Inventors: Dr. Ata Zadeghol
Antennas have found numerous applications, especially in wireless network, near field communication, 3D integration, next generation data storage, etc. While the recent developments in antennas is attributed by low power, smaller size, and interface facility, the realization of complex antenna design and fabrication using cost efficient printed circuit board (PCB) technology is less explored. The current state of art utilizes techniques like Low Temperature Cofired Ceramic (LTCC) that is costly. PCB stacking techniques used with success for design of small wireless sensor nodes has opened a new avenue in designing cost efficient 3D antennas.
Researchers at the University of Idaho have developed a novel hemispherical antenna design that utilizes stacks of two-layer printed circuit boards to create the 3D hemispherical structure. The novel approach overcomes the implementation and fabrication challenges faced by the current state of art by leveraging PCB technology. This method provides simplified alternatives to wire based fabrication methods to realize complex antenna geometries. The novel approach offers considerable cost savings over the Low Temperature Cofired Ceramic (LTCC) technology, which is 20 times the costs of PCB based designs.
- Smart Antenna for mobile devices
- Consumer electronics
- Smart Grids
- 3D Integrated circuits
- Wearable electronics
- Wireless networks
- Cost efficient approach to create 3D hemispherical structure.
- Smaller form factor
- Reduced size compared to wire base antenna
- Reduces overall cost
- Need not remove copper layers below the antenna as compared to ceramic chip antenna
Office of Technology Transfer