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Contact the Department
Phone: (208) 885-6554
Toll-free: 88-88-UIDAHO
Fax: (208) 885-7579
Email: info@ece.uidaho.edu

Buchanan Engineering (BEL)
Room 213

875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Idaho Falls

Contact Debbie Caudle
Phone: (208) 282-7983
Fax: (208) 282-7929
Email: debrac@uidaho.edu

1776 Science Center Drive, Suite 306
Idaho Falls, Idaho 83402

Distance Education

Engineering Outreach
Phone: (208) 885-6373
Toll-free: (800) 824-2889
Fax: (208) 885-9249
E-mail: outreach@uidaho.edu


Electrical Engineering professor Fred Barlow

Fred Barlow, III, Ph.D.

Office: BEL 214
Phone: 208-885-7263
Email: fbarlow@uidaho.edu
Mailing Address: c/o Electrical & Computer Engineering
P.O. Box 441023
Moscow, Idaho 83844-1023

College of Engineering
Electrical & Computer Engineering
Professor and Chair

Campus Locations: Moscow
With UI Since 2006

  • Research/Focus Areas
    • Electronic Packaging
    • IC Fabrication
    • Advanced Microelectronics
  • Biography

    Professor Barlow has served as the major professor for more than twenty graduate students and served as PI or Co-PI for over six million dollars of funded research engaging the microelectronics industry.  Dr. Barlow has published over 100 papers and is coeditor of The Handbook of Thin FilmTechnology (McGraw Hill, 1998), as well as for the Handbook of Ceramic Interconnect Technology (CRC Press, 2007).  He is also a fellow member of the International Microelectronics and Packaging Society (IMAPS) and a senior member of the Institute of Electrical and Electronic Engineers (IEEE).

    Fred Barlow is currently working as a professor and the department chair in the Department  of Electrical and Computer Engineering at the University of Idaho with an emphasis on electronic packaging.  In the past, Dr. Barlow worked for several universities, including Virginia Tech and the University of Arkansas where he held the position of associate department head.

  • Selected Publications

    A Sample of Recent Publications

    “Evaluation of Ceramic Substrates for High Power and High Temperature Applications," Srikanth Kulkarni, Shams Arifeen, Brian Patterson, Gabriel Potirniche, Aicha Elshabini, Fred Barlow, Proceedings of the Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2011 conference, PP 199-206 April, 2011, San Diego, CA.

    “Waveguide Inductive Strip Filter Embedded in LTCC," Ehab Abousaif, A. Elshabini, and F. Barlow, Proceedings of the Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2011 conference, PP 43-49, April, 2011, San Diego, CA.

    “High Power SiC Modules for HEVs and PHEVs,” M. Chinthavali, L. M. Tolbert, H. Zhang, J. H. Han, F.Barlow, B. Ozpineci, International Power Elecronics Conference (IPEC)- ECCE Asia Proceedings, June 21-24, 2010, Sapporo, Japan.

    Fred Barlow, Jared Wood, Aicha Elshabini, Edward F. Stephens, Ryan Feeler, Greg Kemner, Jeremy Junghans, “Fabrication of Precise Fluidic Structures in LTCC," International Journal of Applied Ceramic Technology, Volume 6, No. 1, 2009, pp. 18-23.

    “Finite Element Modeling of a Back Grinding Process for Through Silicon Vias," A. H. Abdelnaby, G. P. Potirniche, F. Barlow, A. Elshabini, R. Parker, Proceedings of the 2011 IEEE Workshop on Microelectronics and Electron Devices (WMED) 2011, Boise, ID, April. 2011, pp. 9-12

    “High Density 50 kW SiC Inverter Systems Using a JFETs Based Six-Pack Power Module," proceedings of the PCIM Europe 2011.

    Wang, G., E. Elvey, F. Barlow, and A. Elshabini, “Fabrication of Micro Vias for LTCC Substrates,” IEEE Transactions on Electronics Packaging Manufacturing, Volume 29, Issue 1, Jan. 2006, Page(s):32 – 41