B.S. Materials Science & Engineering
Inquiries into Materials
Investigate the properties, fabrication processes and behaviors of many different types of materials, from metals and ceramics to semiconductors and biomaterials, and apply this knowledge to improve or create new materials for a variety of purposes as an engineer in this field. Students have the opportunity to conduct experiments in modern labs.
- Energy and Electronics
- Polymers and Plastics
- Pulp and Paper
- Nuclear Materials
- Biomedical and Natural Materials
- Packaging and Formulation
- Top 7 in the Nation – Hands-on experience through our undergraduate Senior Capstone Design Program, recognized by the National Academy of Engineering (NAE) for "infusing real-world experiences into engineering education." – The National Academies Press
- Personalized Attention – Interact directly with faculty through small class sizes, 1-on-1 interaction, mentorship and advising. All faculty hold Ph.D.s in their field.
- Highest Early-Career Salary – Graduate with the highest early-career salary of any 4-year public college in Idaho. You’re also more likely to graduate in 4-years. – PayScale 2019
- More than $25M in Scholarships – U of I awards more scholarships than any 4-year public college in Idaho. – Oct. 26, 2018 News Release
- 98% Graduate With a Job or are enrolled in additional education. – 2016-2018 Career Services Outcomes Survey
- Hands-On Experience, Guaranteed – ALL U of I College of Engineering students participate in hands-on experiences, through our nationally recognized Senior Capstone Design Program and Engineering Design EXPO, Cooperative Education Program (Co-op), Idaho’s only Grand Challenge Scholars Program and paid undergraduate assistantships.
- International Competition Teams - Materials science and engineering student teams frequently place top three in international design competitions.
The Materials Science and Engineering undergraduate degree program is accredited by the Engineering Accreditation Commission of ABET, http://www.abet.org.